Electronic PCB Assembly
1. Having 2 SMT lines.
2. Capable for Running 2 shifts.
SMT Facility/Capability
TECHNICAL CAPABILITIES :-
Our capabilities to process different components of different size in our Production line.
| S.No. | Item | Size |
|---|---|---|
| 1 | Smallest SMT component | 0603mm(0201 Inch) |
| 2 | Largest SMT IC component | 42mm x 42mm, 16 mils |
| 3 | Thinnest SMT chip component | 0.3mm |
| 4 | Thinnest SMT IC component | 1.0mm |
| 5 | Thickest SMT chip component | 12mm |
| 6 | Thickest SMT IC component | 5.0mm |
| 7 | Thinnest PCB board | 0.8mm |
| 8 | Thickest PCB board | 4.0mm |
| 9 | Finest QFP pitch | 0.4mm |
| 10 | BGA (plastics) | 421 Balls |
| 11 | BGA (ceramics) | 303 Balls |
| 12 | Materials | FR2, FR4, FR5, FR10 |
| 13 | PCA Size | Range from 50X50 To 457X356 mm |
| 14 | Trace Width | 8×8 mils, 6×6 mils, 4×4 mils |
| 15 | Pad | Solder mask defined & non-solder mask defined |
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